Back-Grind Tape

---High Temperature Resistance Back-Grind Tape---

Force-One's Backgrind tapes are designed for surface protection of semiconductor wafers during backgrinding or cutting process. It has high temperature resistance, can be removed by cleaning with pure water and no danger of contamination from cleaning fluids.

The benefit of back grind tape:

1.Fully protects the wafer surface during back grinding and prevents wafer surface contamination from infiltration of grinding fluid and/or debris

2.There is virtually no residual adhesive after tape is peeled off.

3.For cases in which slight contamination remains because of wafer surface configuration, the line-up includes a type that can be removed by cleaning with pure water.

Additionally, there is no danger of contamination from cleaning fluids because there are no water-soluble ingredients of light molecular weight in the adhesive.

4.High precision tape thickness accuracy ensures precision wafer thickness after back grinding.